TDK - Ultra-compact Bluetooth low energy modules on a tiny 4.6mm x 5.6m x 1mm footprint (SESUB-PAN-T2541) | 黑森尔电子
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TDK - Ultra-compact Bluetooth low energy modules on a tiny 4.6mm x 5.6m x 1mm footprint (SESUB-PAN-T2541)

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发布日期: 2015-08-25, TDK Corporation
TDK SESUB-PAN-T2541 Bluetooth v4.0 module, ultra-compact Bluetooth low energy module, covers an area of ​​only 4.6mx 5.6mm x 1mm. The module is based on a proprietary semiconductor with embedded substrate (SESUB) technology. The Bluetooth chip is embedded in a thin substrate together with a quartz resonator, bandpass filter and capacitor. The module requires only power and antenna. The Bluetooth v4.0 LE specification greatly reduces the power consumption of battery-powered devices and is ideal for wireless healthcare, sports, fitness, home entertainment, and wearable devices.