Intel 产品

1SX280LU2F50E2VGS1

Intel

2397-PIN FBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.5GHz
• Primary Attributes: FPGA - 2800K Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

EPCS1SI8N

Intel

IC CONFIG DEVICE 1MBIT 8SOIC

• Programmable Type: In System Programmable
• Memory Size: 1Mb
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

封装: 8-SOIC (0.154", 3.90mm Width)

EP20K160EQC240-3N

Intel

IC FPGA 175 I/O 240QFP

• Number of LABs/CLBs: 640
• Number of Logic Elements/Cells: 6400
• Total RAM Bits: 81920
• Number of I/O: 175
• Number of Gates: 404000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 240-BQFP
• Supplier Device Package: 240-PQFP (32x32)

封装: 240-BQFP

EP1K10FC256-2N

Intel

IC FPGA 136 I/O 256FBGA

• Number of LABs/CLBs: 72
• Number of Logic Elements/Cells: 576
• Total RAM Bits: 12288
• Number of I/O: 136
• Number of Gates: 56000
• Voltage - Supply: 2.375 V ~ 2.625 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 256-BBGA
• Supplier Device Package: 256-FBGA (17x17)

封装: 256-BBGA

EPF10K100ABC356-2

Intel

IC FPGA 274 I/O 356BGA

• Number of LABs/CLBs: 624
• Number of Logic Elements/Cells: 4992
• Total RAM Bits: 24576
• Number of I/O: 274
• Number of Gates: 158000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 356-LBGA
• Supplier Device Package: 356-BGA (35x35)

封装: 356-LBGA

EP3SE260H780I3N

Intel

IC FPGA 488 I/O 780HBGA

• Number of LABs/CLBs: 10200
• Number of Logic Elements/Cells: 255000
• Total RAM Bits: 16672768
• Number of I/O: 488
• Number of Gates: -
• Voltage - Supply: 0.86 V ~ 1.15 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

封装: 780-BBGA, FCBGA

EP2S130F1508I4N

Intel

IC FPGA 1126 I/O 1508FBGA

• Number of LABs/CLBs: 6627
• Number of Logic Elements/Cells: 132540
• Total RAM Bits: 6747840
• Number of I/O: 1126
• Number of Gates: -
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1508-BBGA, FCBGA
• Supplier Device Package: 1508-FBGA (30x30)

封装: 1508-BBGA, FCBGA

5SGXEA4K2F35C1N

Intel

IC FPGA 432 I/O 1152FBGA

• Number of LABs/CLBs: 158500
• Number of Logic Elements/Cells: 420000
• Total RAM Bits: 43983872
• Number of I/O: 432
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

10AX057K1F35I1HG

Intel

IC FPGA 396 I/O 1152FCBGA

• Number of LABs/CLBs: 217080
• Number of Logic Elements/Cells: 570000
• Total RAM Bits: 42082304
• Number of I/O: 492
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.98 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

EP2AGX190FF35C4

Intel

IC FPGA 612 I/O 11152FBGA

• Number of LABs/CLBs: 7612
• Number of Logic Elements/Cells: 181165
• Total RAM Bits: 10177536
• Number of I/O: 612
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: 1152-BBGA, FCBGA

EP2AGX190EF29C6

Intel

IC FPGA 372 I/O 1780FBGA

• Number of LABs/CLBs: 7612
• Number of Logic Elements/Cells: 181165
• Total RAM Bits: 10177536
• Number of I/O: 372
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-FBGA (29x29)

封装: 780-BBGA, FCBGA

EP2AGX65DF25C6N

Intel

IC FPGA 252 I/O 572FBGA

• Number of LABs/CLBs: 2530
• Number of Logic Elements/Cells: 60214
• Total RAM Bits: 5371904
• Number of I/O: 252
• Number of Gates: -
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 572-BGA, FCBGA
• Supplier Device Package: 572-FBGA, FC (25x25)

封装: 572-BGA, FCBGA

EPM3064ATI44-10

Intel

IC CPLD 64MC 10NS 44TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 10.0ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 64
• Number of Gates: 1250
• Number of I/O: 34
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

封装: 44-TQFP

EPM570GT100C4N

Intel

IC CPLD 440MC 5.4NS 100TQFP

• Programmable Type: In System Programmable
• Delay Time tpd(1) Max: 5.4ns
• Voltage Supply - Internal: 1.71 V ~ 1.89 V
• Number of Logic Elements/Blocks: 570
• Number of Macrocells: 440
• Number of Gates: -
• Number of I/O: 76
• Operating Temperature: 0°C ~ 85°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 100-TQFP
• Supplier Device Package: 100-TQFP (14x14)

封装: 100-TQFP

5AGXMA7G4F31I5G

Intel

IC FPGA 384 I/O 896FBGA

• Number of LABs/CLBs: 11460
• Number of Logic Elements/Cells: 242000
• Total RAM Bits: 15470592
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

封装: 896-BBGA, FCBGA

5AGXMA5G4F31I3G

Intel

IC FPGA 384 I/O 896FBGA

• Number of LABs/CLBs: 8962
• Number of Logic Elements/Cells: 190000
• Total RAM Bits: 13284352
• Number of I/O: 384
• Number of Gates: -
• Voltage - Supply: 1.12V ~ 1.18V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FBGA (31x31)

封装: 896-BBGA, FCBGA

5SGSMD5H2F35C3G

Intel

IC FPGA 552 I/O 1152FBGA

• Number of LABs/CLBs: 172600
• Number of Logic Elements/Cells: 457000
• Total RAM Bits: 39936000
• Number of I/O: 552
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FBGA (35x35)

封装: -

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AGFB019R24C2I1V

Intel

IC

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.9M Logic Elements
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2340-BFBGA Exposed Pad
• Supplier Device Package: 2340-BGA (45x42)

封装: -

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AGFB012R24C2E1V

Intel

IC FPGA AGILEX-F 2340FBGA

• Architecture: MPU, FPGA
• Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 1.4GHz
• Primary Attributes: FPGA - 1.2M Logic Elements
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: -
• Supplier Device Package: -

封装: -

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5SGXEA9N3F45C3G

Intel

IC FPGA 840 I/O 1932FBGA

• Number of LABs/CLBs: 317000
• Number of Logic Elements/Cells: 840000
• Total RAM Bits: 53248000
• Number of I/O: 840
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1932-BBGA, FCBGA
• Supplier Device Package: 1932-FBGA, FC (45x45)

封装: -

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1SG166HN2F43I2VGAS

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 207500
• Number of Logic Elements/Cells: 1660000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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5SGXMA3E2H29C1WN

Intel

IC FPGA 600 I/O 780HBGA

• Number of LABs/CLBs: 128300
• Number of Logic Elements/Cells: 340000
• Total RAM Bits: 19456000
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.87V ~ 0.93V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 780-BBGA, FCBGA
• Supplier Device Package: 780-HBGA (33x33)

封装: -

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1SG280LN3F43E2VGS3

Intel

IC FPGA 688 I/O 1760FBGA

• Number of LABs/CLBs: 350000
• Number of Logic Elements/Cells: 2800000
• Total RAM Bits: -
• Number of I/O: 688
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FBGA (42.5x42.5)

封装: -

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RH80536NC0251M

Intel

IC MPU 380 1.6GHZ 478PPGA

• Core Processor: Intel® Celeron® M Processor 380
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.6GHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.004V, 1.292V
• Operating Temperature: 100°C (TJ)
• Security Features: -
• Package / Case: 478-PGA
• Supplier Device Package: 478-PPGA (35x35)

封装: -

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1ST210EU2F50I1VGAS

Intel

IC FPGA 440 I/O 2397BGA

• Number of LABs/CLBs: 262500
• Number of Logic Elements/Cells: 2100000
• Total RAM Bits: -
• Number of I/O: 440
• Number of Gates: -
• Voltage - Supply: 0.77V ~ 0.97V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 2397-BBGA, FCBGA
• Supplier Device Package: 2397-FBGA, FC (50x50)

封装: -

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5SGSMD8K2F40I2LG

Intel

IC FPGA 696 I/O 1517FBGA

• Number of LABs/CLBs: 262400
• Number of Logic Elements/Cells: 695000
• Total RAM Bits: 51200000
• Number of I/O: 696
• Number of Gates: -
• Voltage - Supply: 0.82V ~ 0.88V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA (40x40)

封装: -

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N8044AH

Intel

8-BIT, MROM, 8051 CPU, 12MHZ

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 12MHz
• Connectivity: HDLC
• Peripherals: -
• Number of I/O: 32
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: Mask ROM
• EEPROM Size: -
• RAM Size: 192 x 8
• Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
• Data Converters: -
• Oscillator Type: External, Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC

封装: -

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5AGXFB7K4F40C5G

Intel

IC FPGA 704 I/O 1517FBGA

• Number of LABs/CLBs: 23780
• Number of Logic Elements/Cells: 504000
• Total RAM Bits: 27695104
• Number of I/O: 704
• Number of Gates: -
• Voltage - Supply: 1.07V ~ 1.13V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FBGA, FC (40x40)

封装: -

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