页 244 - Intel 产品 | 黑森尔电子
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Intel 产品

记录 9,824
页  244/351
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5CSXFC4C6U23C6N
Intel

IC FPGA 224 I/O 672UBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 64KB
  • Peripherals: DMA, POR, WDT
  • Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 925MHz
  • Primary Attributes: FPGA - 40K Logic Elements
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 672-FBGA
  • Supplier Device Package: 672-UBGA (23x23)
封装: 672-FBGA
库存7,008
EP1S40F780I8
Intel

IC FPGA STRATIX 780FBGA

  • Number of LABs/CLBs: 4125
  • Number of Logic Elements/Cells: 41250
  • Total RAM Bits: 3423744
  • Number of I/O: 615
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存7,648
EPF10K130EBC600-1E
Intel

IC FPGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 6656
  • Total RAM Bits: 65536
  • Number of I/O: 424
  • Number of Gates: 342000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 600-BGA
  • Supplier Device Package: 600-BGA (45x45)
封装: 600-BGA
库存5,792
hot EPF10K30EFC256-1
Intel

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 216
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 24576
  • Number of I/O: 176
  • Number of Gates: 119000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
封装: 256-BGA
库存15,120
EPF10K130EBC356-2
Intel

IC FPGA 274 I/O 356BGA

  • Number of LABs/CLBs: 832
  • Number of Logic Elements/Cells: 6656
  • Total RAM Bits: 65536
  • Number of I/O: 274
  • Number of Gates: 342000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Package / Case: 356-LBGA
  • Supplier Device Package: 356-BGA (35x35)
封装: 356-LBGA
库存2,912
EP1S80F1508I7N
Intel

IC FPGA 1203 I/O 1508FBGA

  • Number of LABs/CLBs: 7904
  • Number of Logic Elements/Cells: 79040
  • Total RAM Bits: 7427520
  • Number of I/O: 1203
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1508-BBGA, FCBGA
  • Supplier Device Package: 1508-FBGA (30x30)
封装: 1508-BBGA, FCBGA
库存6,864
EP4SE360H29I3
Intel

IC FPGA 488 I/O 780HBGA

  • Number of LABs/CLBs: 14144
  • Number of Logic Elements/Cells: 353600
  • Total RAM Bits: 23105536
  • Number of I/O: 488
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封装: 780-BBGA, FCBGA
库存4,304
5SGXEA7N3F45C4
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 59939840
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: 1932-BBGA, FCBGA
库存5,472
5SGSED6K3F40C4N
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 220000
  • Number of Logic Elements/Cells: 583000
  • Total RAM Bits: 54553600
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82 V ~ 0.88 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存7,376
10AX090H3F34I2SG
Intel

IC FPGA 504 I/O 1152FCBGA

  • Number of LABs/CLBs: 339620
  • Number of Logic Elements/Cells: 900000
  • Total RAM Bits: 59234304
  • Number of I/O: 504
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
封装: 1152-BBGA, FCBGA
库存3,616
10AX057K2F40I1HG
Intel

IC FPGA 696 I/O 1517FCBGA

  • Number of LABs/CLBs: 217080
  • Number of Logic Elements/Cells: 570000
  • Total RAM Bits: 42082304
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.98 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: 1517-BBGA, FCBGA
库存2,576
10AX027E3F29I2LG
Intel

780-PIN FBGA

  • Number of LABs/CLBs: 101620
  • Number of Logic Elements/Cells: 270000
  • Total RAM Bits: 17870848
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-FBGA (29x29)
封装: 780-BBGA, FCBGA
库存3,136
hot EPM3032ALC44-7
Intel

IC CPLD 32MC 7.5NS 44PLCC

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 600
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封装: 44-LCC (J-Lead)
库存6,560
AGID019R18A1I2VB
Intel

IC

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 1.9M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1805-BBGA Exposed Pad
  • Supplier Device Package: 1805-BGA (42.5x42.5)
封装: -
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AGFC023R24C3E3E
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
Request a Quote
1SX210HN3F43I3VG
Intel

IC FPGA STRATIX 10 1760FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.5GHz
  • Primary Attributes: FPGA - 2100K Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封装: -
Request a Quote
1SG110HN3F43E1VG
Intel

IC FPGA 688 I/O 1760FBGA

  • Number of LABs/CLBs: 137500
  • Number of Logic Elements/Cells: 1100000
  • Total RAM Bits: -
  • Number of I/O: 688
  • Number of Gates: -
  • Voltage - Supply: 0.77V ~ 0.97V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封装: -
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5SGXMA7K3F40I4WN
Intel

IC FPGA 696 I/O 1517FBGA

  • Number of LABs/CLBs: 234720
  • Number of Logic Elements/Cells: 622000
  • Total RAM Bits: 51200000
  • Number of I/O: 696
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA (40x40)
封装: -
Request a Quote
AGIA035R39A2I3V
Intel

IC FPGA AGILEX-I 3948FBGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 3.54M Logic Elements
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 3948-BFBGA Exposed Pad
  • Supplier Device Package: 3948-BGA (56x56)
封装: -
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5SGXMABN2F45C2G
Intel

IC FPGA 840 I/O 1932FBGA

  • Number of LABs/CLBs: 359200
  • Number of Logic Elements/Cells: 952000
  • Total RAM Bits: 53248000
  • Number of I/O: 840
  • Number of Gates: -
  • Voltage - Supply: 0.87V ~ 0.93V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1932-BBGA, FCBGA
  • Supplier Device Package: 1932-FBGA, FC (45x45)
封装: -
Request a Quote
1ST110EN2F43I2LGAS
Intel

IC FPGA 440 I/O 1760FBGA

  • Number of LABs/CLBs: 137500
  • Number of Logic Elements/Cells: 1100000
  • Total RAM Bits: -
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FBGA (42.5x42.5)
封装: -
Request a Quote
5SGSMD4E2H29C3WN
Intel

IC FPGA 360 I/O 780HBGA

  • Number of LABs/CLBs: 135840
  • Number of Logic Elements/Cells: 360000
  • Total RAM Bits: 19456000
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.82V ~ 0.88V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 780-BBGA, FCBGA
  • Supplier Device Package: 780-HBGA (33x33)
封装: -
Request a Quote
EP2AGZ350HF40I4G
Intel

IC FPGA 734 I/O 1517FBGA

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: -
  • Number of I/O: -
  • Number of Gates: -
  • Voltage - Supply: -
  • Mounting Type: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
Request a Quote
TN82527
Intel

LAN CONTROLLER, 2 CHANNEL(S), CM

  • Protocol: -
  • Function: Controller
  • Interface: -
  • Standards: -
  • Voltage - Supply: 4.5V ~ 5.5V
  • Current - Supply: 50mA
  • Operating Temperature: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC
封装: -
Request a Quote
5AGXFB7K4F40I5G
Intel

IC FPGA 704 I/O 1517FBGA

  • Number of LABs/CLBs: 23786
  • Number of Logic Elements/Cells: 504140
  • Total RAM Bits: 2975744
  • Number of I/O: 704
  • Number of Gates: -
  • Voltage - Supply: 1.07V ~ 1.13V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FBGA, FC (40x40)
封装: -
Request a Quote
EPM240T100C5AA
Intel

IC CPLD 192MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 7.5 ns
  • Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
  • Number of Logic Elements/Blocks: 240
  • Number of Macrocells: 192
  • Number of Gates: -
  • Number of I/O: 80
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-TQFP (14x14)
封装: -
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AGFD023R24C2E4X
Intel

IC FPGA AGILEX-F 2340BGA

  • Architecture: MPU, FPGA
  • Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1.4GHz
  • Primary Attributes: FPGA - 2.3M Logic Elements
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2340-BFBGA Exposed Pad
  • Supplier Device Package: 2340-BGA (45x42)
封装: -
Request a Quote
A5EC065BB32AE4SR0
Intel

IC

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
封装: -
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