页 16 - TE Connectivity AMP Connectors 产品 - 用于 IC 的插座，晶体管

8080-1G1-LF

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS TIN

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存2,322

3 (Oval)

-

Tin

200µin (5.08µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Tin

200µin (5.08µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

4-1437537-1

TE Connectivity AMP Connectors

816-AG11F=SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存3,526

-

8080-1G9

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 4POS GOLD

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 4 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Fluoropolymer (FP)
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,438

4 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Fluoropolymer (FP)

-55°C ~ 125°C

1-1981837-2

TE Connectivity AMP Connectors

SOCKET ASSY LGA1366, 0.76 AU LEA

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存3,366

-

8-1437532-6

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存8,586

-

8-1437504-6

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存8,640

-

1-1437531-5

TE Connectivity AMP Connectors

514-21875=ASSEMBLY, SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存3,366

-

1981837-2

TE Connectivity AMP Connectors

CONN SOCKET LGA 1366POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1366 (32 x 41)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.040" (1.01mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

封装: -

库存8,910

1366 (32 x 41)

0.040" (1.01mm)

Gold

30µin (0.76µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.040" (1.01mm)

-

Copper Alloy

Thermoplastic

-

545092-4

TE Connectivity AMP Connectors

CONN SOCKET PGA 48POS TIN-LEAD

Type: PGA
Number of Positions or Pins (Grid): 48 (4 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Brass
Housing Material: Polybutylene Terephthalate (PBT), Polyester
Operating Temperature: -40°C ~ 105°C

封装: -

库存4,158

48 (4 x 12)

0.100" (2.54mm)

Tin-Lead

100µin (2.54µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

100µin (2.54µm)

Brass

Polybutylene Terephthalate (PBT), Polyester

-40°C ~ 105°C

210790-4

TE Connectivity AMP Connectors

PGA128P13 TIN STD/.75AU24C CFN

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存3,006

-

1747890-2

TE Connectivity AMP Connectors

DSL ASSY LGA771 LEADED, 076 GOLD

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存4,860

-

8059-2G5

TE Connectivity AMP Connectors

CONN TRANSIST

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存5,346

-

8060-1G17

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 3POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 3 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Panel Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,690

3 (Round)

-

Gold

-

Beryllium Copper

Panel Mount

Closed Frame

Solder

-

Gold

-

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

1761503-1

TE Connectivity AMP Connectors

CONN SOCKET PGA 940POS GOLD

Type: PGA
Number of Positions or Pins (Grid): 940 (30 x 30)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: -
Mounting Type: Surface Mount
Features: Closed Frame
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存5,526

940 (30 x 30)

0.050" (1.27mm)

Gold

30µin (0.76µm)

-

Surface Mount

Closed Frame

-

1554116-2

TE Connectivity AMP Connectors

CONN SOCKET LGA 1356POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1356 (32 x 41)
Pitch - Mating: 0.040" (1.01mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Open Frame
Termination: Solder
Pitch - Post: 0.040" (1.01mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -25°C ~ 100°C

封装: -

库存5,472

1356 (32 x 41)

0.040" (1.01mm)

Gold

15µin (0.38µm)

Copper Alloy

Surface Mount

Open Frame

Solder

0.040" (1.01mm)

Gold

15µin (0.38µm)

Copper Alloy

Thermoplastic

-25°C ~ 100°C

8058-24G1

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 10POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 10 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存8,820

10 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

3-1437508-1

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 8POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 8 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,786

8 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

8058-1G31

TE Connectivity AMP Connectors

CONN TRANSIST TO-5 10POS GOLD

Type: Transistor, TO-5
Number of Positions or Pins (Grid): 10 (Round)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: -
Contact Material - Post: Brass
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,138

10 (Round)

-

Gold

-

Beryllium Copper

Through Hole

Closed Frame

Solder

-

Gold

-

Brass

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

1825088-2

TE Connectivity AMP Connectors

512-AG7D-LF=R/A DIP; ROHS; GOLD/

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存3,204

-

1-1437532-5

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: Through Hole
Features: Closed Frame
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存8,442

24 (2 x 12)

0.100" (2.54mm)

Gold

-

Through Hole

Closed Frame

Wire Wrap

0.100" (2.54mm)

Tin-Lead

-

9-1437504-1

TE Connectivity AMP Connectors

CONN TRANSIST TO-3 3POS GOLD

Type: Transistor, TO-3
Number of Positions or Pins (Grid): 3 (Oval)
Pitch - Mating: -
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Chassis Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: -
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polytetrafluoroethylene (PTFE)
Operating Temperature: -55°C ~ 125°C

封装: -

库存3,024

3 (Oval)

-

Gold

30µin (0.76µm)

Beryllium Copper

Chassis Mount

Closed Frame

Solder

-

Gold

30µin (0.76µm)

Beryllium Copper

Polytetrafluoroethylene (PTFE)

-55°C ~ 125°C

4-1437532-4

TE Connectivity AMP Connectors

SOCKET ASSY

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存5,292

-

1-1571551-0

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Nickel
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature: -55°C ~ 105°C

封装: -

库存4,590

32 (2 x 16)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Nickel

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester

-55°C ~ 105°C

1939737-1

TE Connectivity AMP Connectors

CONN SOCKET LGA 1366POS

Type: LGA
Number of Positions or Pins (Grid): 1366 (32 x 41)
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存7,182

1366 (32 x 41)

-

210815-4

TE Connectivity AMP Connectors

PGA223P18 TIN STD/.75AU24C OFN

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存8,766

-

210796-4

TE Connectivity AMP Connectors

OPN FRM PGA 15/15, 144 SKT

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存3,400

-

210223-4

TE Connectivity AMP Connectors

PGA114P13 TIN STD/.75AU24C OFN

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封装: -

库存7,182

-

2040540-2

TE Connectivity AMP Connectors

CONN SOCKET LGA 1156POS GOLD

Type: LGA
Number of Positions or Pins (Grid): 1156 (34 x 34)
Pitch - Mating: 0.036" (0.91mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: Flash
Contact Material - Mating: Copper Alloy
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.039" (1.00mm)
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: Copper Alloy
Housing Material: Thermoplastic
Operating Temperature: -

封装: -

库存4,464

1156 (34 x 34)

0.036" (0.91mm)

Gold

Flash

Copper Alloy

Surface Mount

Closed Frame

Solder

0.039" (1.00mm)

-

Copper Alloy

Thermoplastic

-

零件编号	制造商	描述	封装	库存	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
8080-1G1-LF	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS TIN Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 200µin (5.08µm) Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Tin Contact Finish Thickness - Post: 200µin (5.08µm) Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	封装: -	库存2,322	3 (Oval)	-	Tin	200µin (5.08µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Tin	200µin (5.08µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
4-1437537-1	TE Connectivity AMP Connectors	816-AG11F=SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存3,526	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8080-1G9	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 4POS GOLD Type: Transistor, TO-3 Number of Positions or Pins (Grid): 4 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Fluoropolymer (FP) Operating Temperature: -55°C ~ 125°C	封装: -	库存3,438	4 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Fluoropolymer (FP)	-55°C ~ 125°C
1-1981837-2	TE Connectivity AMP Connectors	SOCKET ASSY LGA1366, 0.76 AU LEA Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存3,366	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8-1437532-6	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存8,586	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8-1437504-6	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存8,640	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-1437531-5	TE Connectivity AMP Connectors	514-21875=ASSEMBLY, SOCKET Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存3,366	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1981837-2	TE Connectivity AMP Connectors	CONN SOCKET LGA 1366POS GOLD Type: LGA Number of Positions or Pins (Grid): 1366 (32 x 41) Pitch - Mating: 0.040" (1.01mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.040" (1.01mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	封装: -	库存8,910	1366 (32 x 41)	0.040" (1.01mm)	Gold	30µin (0.76µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.040" (1.01mm)	-	-	Copper Alloy	Thermoplastic	-
545092-4	TE Connectivity AMP Connectors	CONN SOCKET PGA 48POS TIN-LEAD Type: PGA Number of Positions or Pins (Grid): 48 (4 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100µin (2.54µm) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 100µin (2.54µm) Contact Material - Post: Brass Housing Material: Polybutylene Terephthalate (PBT), Polyester Operating Temperature: -40°C ~ 105°C	封装: -	库存4,158	48 (4 x 12)	0.100" (2.54mm)	Tin-Lead	100µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	100µin (2.54µm)	Brass	Polybutylene Terephthalate (PBT), Polyester	-40°C ~ 105°C
210790-4	TE Connectivity AMP Connectors	PGA128P13 TIN STD/.75AU24C CFN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存3,006	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1747890-2	TE Connectivity AMP Connectors	DSL ASSY LGA771 LEADED, 076 GOLD Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存4,860	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8059-2G5	TE Connectivity AMP Connectors	CONN TRANSIST Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存5,346	-	-	-	-	-	-	-	-	-	-	-	-	-	-
8060-1G17	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 3POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 3 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Panel Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	封装: -	库存3,690	3 (Round)	-	Gold	-	Beryllium Copper	Panel Mount	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
1761503-1	TE Connectivity AMP Connectors	CONN SOCKET PGA 940POS GOLD Type: PGA Number of Positions or Pins (Grid): 940 (30 x 30) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: - Mounting Type: Surface Mount Features: Closed Frame Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存5,526	940 (30 x 30)	0.050" (1.27mm)	Gold	30µin (0.76µm)	-	Surface Mount	Closed Frame	-	-	-	-	-	-	-
1554116-2	TE Connectivity AMP Connectors	CONN SOCKET LGA 1356POS GOLD Type: LGA Number of Positions or Pins (Grid): 1356 (32 x 41) Pitch - Mating: 0.040" (1.01mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15µin (0.38µm) Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Open Frame Termination: Solder Pitch - Post: 0.040" (1.01mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 15µin (0.38µm) Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -25°C ~ 100°C	封装: -	库存5,472	1356 (32 x 41)	0.040" (1.01mm)	Gold	15µin (0.38µm)	Copper Alloy	Surface Mount	Open Frame	Solder	0.040" (1.01mm)	Gold	15µin (0.38µm)	Copper Alloy	Thermoplastic	-25°C ~ 100°C
8058-24G1	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 10POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 10 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	封装: -	库存8,820	10 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
3-1437508-1	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 8POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 8 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	封装: -	库存6,786	8 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
8058-1G31	TE Connectivity AMP Connectors	CONN TRANSIST TO-5 10POS GOLD Type: Transistor, TO-5 Number of Positions or Pins (Grid): 10 (Round) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: - Contact Material - Post: Brass Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	封装: -	库存6,138	10 (Round)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Brass	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
1825088-2	TE Connectivity AMP Connectors	512-AG7D-LF=R/A DIP; ROHS; GOLD/ Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存3,204	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-1437532-5	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 24POS GOLD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 24 (2 x 12) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: Through Hole Features: Closed Frame Termination: Wire Wrap Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存8,442	24 (2 x 12)	0.100" (2.54mm)	Gold	-	-	Through Hole	Closed Frame	Wire Wrap	0.100" (2.54mm)	Tin-Lead	-	-	-	-
9-1437504-1	TE Connectivity AMP Connectors	CONN TRANSIST TO-3 3POS GOLD Type: Transistor, TO-3 Number of Positions or Pins (Grid): 3 (Oval) Pitch - Mating: - Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30µin (0.76µm) Contact Material - Mating: Beryllium Copper Mounting Type: Chassis Mount Features: Closed Frame Termination: Solder Pitch - Post: - Contact Finish - Post: Gold Contact Finish Thickness - Post: 30µin (0.76µm) Contact Material - Post: Beryllium Copper Housing Material: Polytetrafluoroethylene (PTFE) Operating Temperature: -55°C ~ 125°C	封装: -	库存3,024	3 (Oval)	-	Gold	30µin (0.76µm)	Beryllium Copper	Chassis Mount	Closed Frame	Solder	-	Gold	30µin (0.76µm)	Beryllium Copper	Polytetrafluoroethylene (PTFE)	-55°C ~ 125°C
4-1437532-4	TE Connectivity AMP Connectors	SOCKET ASSY Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存5,292	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-1571551-0	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 32POS TIN Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: - Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: - Contact Material - Post: Nickel Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Operating Temperature: -55°C ~ 105°C	封装: -	库存4,590	32 (2 x 16)	0.100" (2.54mm)	Tin	-	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Tin	-	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
1939737-1	TE Connectivity AMP Connectors	CONN SOCKET LGA 1366POS Type: LGA Number of Positions or Pins (Grid): 1366 (32 x 41) Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存7,182	1366 (32 x 41)	-	-	-	-	-	-	-	-	-	-	-	-	-
210815-4	TE Connectivity AMP Connectors	PGA223P18 TIN STD/.75AU24C OFN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存8,766	-	-	-	-	-	-	-	-	-	-	-	-	-	-
210796-4	TE Connectivity AMP Connectors	OPN FRM PGA 15/15, 144 SKT Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存3,400	-	-	-	-	-	-	-	-	-	-	-	-	-	-
210223-4	TE Connectivity AMP Connectors	PGA114P13 TIN STD/.75AU24C OFN Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	封装: -	库存7,182	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2040540-2	TE Connectivity AMP Connectors	CONN SOCKET LGA 1156POS GOLD Type: LGA Number of Positions or Pins (Grid): 1156 (34 x 34) Pitch - Mating: 0.036" (0.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: Flash Contact Material - Mating: Copper Alloy Mounting Type: Surface Mount Features: Closed Frame Termination: Solder Pitch - Post: 0.039" (1.00mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: Copper Alloy Housing Material: Thermoplastic Operating Temperature: -	封装: -	库存4,464	1156 (34 x 34)	0.036" (0.91mm)	Gold	Flash	Copper Alloy	Surface Mount	Closed Frame	Solder	0.039" (1.00mm)	-	-	Copper Alloy	Thermoplastic	-