页 19 - TE Connectivity AMP Connectors 产品 - 用于 IC 的插座，晶体管

643657-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 25POS TIN

Type: SIP
Number of Positions or Pins (Grid): 25 (1 x 25)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,412

25 (1 x 25)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

643652-6

TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS TIN

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存3,438

20 (1 x 20)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

643652-3

TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS TIN

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存6,876

20 (1 x 20)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

643652-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 20POS TIN

Type: SIP
Number of Positions or Pins (Grid): 20 (1 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存7,974

20 (1 x 20)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

643650-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 18POS TIN

Type: SIP
Number of Positions or Pins (Grid): 18 (1 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存4,986

18 (1 x 18)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

643646-3

TE Connectivity AMP Connectors

CONN SOCKET SIP 14POS TIN

Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存3,312

14 (1 x 14)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

643646-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 14POS TIN

Type: SIP
Number of Positions or Pins (Grid): 14 (1 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存3,276

14 (1 x 14)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

643644-3

TE Connectivity AMP Connectors

CONN SOCKET SIP 12POS TIN

Type: SIP
Number of Positions or Pins (Grid): 12 (1 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存4,320

12 (1 x 12)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

643641-6

TE Connectivity AMP Connectors

CONN SOCKET SIP 9POS TIN

Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存7,272

9 (1 x 9)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

641856-1

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存6,768

28 (2 x 14)

0.100" (2.54mm)

Tin

-

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 105°C

4-382568-8

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 48POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,508

48 (2 x 24)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

382444-2

TE Connectivity AMP Connectors

CONN SOCKET SIP 8POS TIN-LEAD

Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 150µin (3.81µm)
Contact Material - Post: Beryllium Copper
Housing Material: Fluoropolymer (FP)
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,268

8 (1 x 8)

0.100" (2.54mm)

Tin-Lead

150µin (3.81µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin-Lead

150µin (3.81µm)

Beryllium Copper

Fluoropolymer (FP)

-55°C ~ 105°C

382441-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 7POS TIN

Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存8,658

7 (1 x 7)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

382438-1

TE Connectivity AMP Connectors

CONN SOCKET SIP 4POS TIN

Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存6,984

4 (1 x 4)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

3-382568-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存2,100

32 (2 x 16)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

2-641616-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 125°C

封装: -

库存4,896

40 (2 x 20)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Thermoplastic

-55°C ~ 125°C

2-641615-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,110

28 (2 x 14)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 125°C

2-641606-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,850

40 (2 x 20)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 125°C

2-641604-2

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 24POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Beryllium Copper
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存7,326

24 (2 x 12)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Thermoplastic, Glass Filled

-55°C ~ 125°C

2-641602-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS GOLD

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 125°C

封装: -

库存6,210

20 (2 x 10)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Thermoplastic

-55°C ~ 125°C

2-641268-4

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 40POS GOLD

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 125°C

封装: -

库存5,148

40 (2 x 20)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 125°C

2-382568-8

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,274

28 (2 x 14)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

2-382568-0

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic, Glass Filled
Operating Temperature: -55°C ~ 105°C

封装: -

库存8,352

20 (2 x 10)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic, Glass Filled

-55°C ~ 105°C

2-382470-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 32POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,652

32 (2 x 16)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin-Lead

-

Phosphor Bronze

Thermoplastic

-55°C ~ 105°C

2-382467-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 105°C

封装: -

库存8,136

28 (2 x 14)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic

-55°C ~ 105°C

2-382465-3

TE Connectivity AMP Connectors

CONN IC DIP SOCKET 20POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: -
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: -
Contact Material - Post: Phosphor Bronze
Housing Material: Thermoplastic
Operating Temperature: -55°C ~ 105°C

封装: -

库存5,724

20 (2 x 10)

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

-

Phosphor Bronze

Thermoplastic

-55°C ~ 105°C

916715-1

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 321POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 321 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15µin (0.38µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 15µin (0.38µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

封装: -

库存4,320

321 (19 x 19)

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

15µin (0.38µm)

Phosphor Bronze

Liquid Crystal Polymer (LCP)

-

916657-1

TE Connectivity AMP Connectors

CONN SOCKET PGA ZIF 321POS GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): 321 (19 x 19)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30µin (0.76µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Liquid Crystal Polymer (LCP)
Operating Temperature: -

封装: -

库存7,920

321 (19 x 19)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Phosphor Bronze

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Gold

30µin (0.76µm)

Phosphor Bronze

Liquid Crystal Polymer (LCP)

-