页 128 - NXP 产品 - 嵌入式 - 微控制器

SPC5777CAK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存5,328

32-Bit Tri-Core

264MHz

EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CRK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存4,736

32-Bit Tri-Core

264MHz

EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CSK3MME3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存6,016

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5748GHK0AMMJ6

NXP

ULTRA RELIABLE MCU WITH VAST PER

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

封装: 256-LBGA

库存7,136

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5675KFF0VMM2R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封装: 257-LFBGA

库存5,040

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 22x12b

Internal

-40°C ~ 105°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

SPC5675KFAVMM2R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封装: 257-LFBGA

库存9,828

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 22x12b

Internal

-40°C ~ 105°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

SPC5748GHK0AMKU6

NXP

ULTRA RELIABLE MCU WITH VAST PER

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

封装: 176-LQFP Exposed Pad

库存7,584

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

129

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

176-LQFP Exposed Pad

176-LQFP (24x24)

SPC5777CLK3MME3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存5,072

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

MAC7116VAG50

NXP

32-BIT MCU ARM7TDMI-S 32KB FLA

Core Processor: ARM7®
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals: DMA, POR
Number of I/O: 112
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 32K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 16x8/10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封装: 144-LQFP

库存4,992

32-Bit

50MHz

CANbus, EBI/EMI, I²C, SCI, SPI

DMA, POR

112

1MB (1M x 8)

FLASH

32K x 8

48K x 8

2.35 V ~ 5.5 V

A/D 16x8/10b

Internal

-40°C ~ 105°C (TA)

-

144-LQFP

144-LQFP (20x20)

SPC5777CDK3MME3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存6,432

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5777CSK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存7,984

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5777CRK3MME3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存3,888

32-Bit Tri-Core

264MHz

EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5777CAK3MME3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存6,224

32-Bit Tri-Core

264MHz

EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5748GTK0AMMJ6

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

封装: 256-LBGA

库存2,752

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5748GTK0AMKU6

NXP

TRIPLE CORE 6M FLASH

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

封装: 176-LQFP Exposed Pad

库存6,080

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

129

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

176-LQFP Exposed Pad

176-LQFP (24x24)

SP5748GBK0AMMN6R

NXP

TRIPLE CORE 6M FLASH

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 246
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-LBGA
Supplier Device Package: 324-MAPBGA (19x19)

封装: 324-LBGA

库存2,912

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

246

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

324-LBGA

324-MAPBGA (19x19)

SPC5777CLK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存4,000

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CDK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存7,536

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CCK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存6,960

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SP5748GHK0AMMJ6R

NXP

ULTRA RELIABLE MCU WITH VAST PER

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

封装: 256-LBGA

库存6,336

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5645SF1CVU

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z4d
Core Size: 32-Bit
Speed: 125MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.064M x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 20x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存2,256

32-Bit

125MHz

CANbus, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

2MB (2M x 8)

FLASH

-

1.064M x 8

3 V ~ 5.5 V

A/D 20x10b

Internal

-40°C ~ 85°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5674KAVMS2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封装: 473-LFBGA

库存4,992

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

1.5MB (1.5M x 8)

FLASH

64K x 8

384K x 8

1.14 V ~ 5.5 V

A/D 34x12b

Internal

-40°C ~ 105°C (TA)

-

473-LFBGA

473-MAPBGA (19x19)

SPC5777CK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存2,192

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CAK3MMO3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存3,552

32-Bit Tri-Core

264MHz

EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5646CCK0MLT1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

封装: 208-LQFP

库存5,504

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 125°C (TA)

-

208-LQFP

208-TQFP (28x28)

SPC5646CCF0MLT1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

封装: 208-LQFP

库存3,520

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 125°C (TA)

-

208-LQFP

208-TQFP (28x28)

SPC5674KAVMM2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封装: 257-LFBGA

库存5,664

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

1.5MB (1.5M x 8)

FLASH

64K x 8

384K x 8

1.14 V ~ 5.5 V

A/D 22x12b

Internal

-40°C ~ 105°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

SPC5748GBK0AMMJ6

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

封装: 256-LBGA

库存4,416

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)