页 129 - NXP 产品 - 嵌入式 - 微控制器

SPC5673FK0MVR2

NXP

3M FLASH 256K RAM Z7 200MHZ

Core Processor: e200z7
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存3,888

32-Bit

200MHz

CANbus, SCI, SPI

DMA, POR, PWM

32

3MB (3M x 8)

FLASH

-

192K x 8

1.08 V ~ 5.25 V

A/D 64x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5673FF3MVR2

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z7
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存7,456

32-Bit

200MHz

CANbus, SCI, SPI

DMA, POR, PWM

32

3MB (3M x 8)

FLASH

-

192K x 8

1.08 V ~ 5.25 V

A/D 64x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5566MZP80

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z6
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存4,272

32-Bit

80MHz

CANbus, EBI/EMI, Ethernet, SCI, SPI

DMA, POR, PWM, WDT

256

3MB (3M x 8)

FLASH

-

128K x 8

1.35 V ~ 1.65 V

A/D 40x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5673FK0MVR2R

NXP

3M FLASH 256K RAM Z7 200MHZ

Core Processor: e200z7
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存9,672

32-Bit

200MHz

CANbus, SCI, SPI

DMA, POR, PWM

32

3MB (3M x 8)

FLASH

-

192K x 8

1.08 V ~ 5.25 V

A/D 64x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5673FF3MVR2R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z7
Core Size: 32-Bit
Speed: 200MHz
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Number of I/O: 32
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 5.25 V
Data Converters: A/D 64x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存4,032

32-Bit

200MHz

CANbus, SCI, SPI

DMA, POR, PWM

32

3MB (3M x 8)

FLASH

-

192K x 8

1.08 V ~ 5.25 V

A/D 64x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5566MZP80R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z6
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存6,240

32-Bit

80MHz

CANbus, EBI/EMI, Ethernet, SCI, SPI

DMA, POR, PWM, WDT

256

3MB (3M x 8)

FLASH

-

128K x 8

1.35 V ~ 1.65 V

A/D 40x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5554MVR132

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z6
Core Size: 32-Bit
Speed: 132MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存5,616

32-Bit

132MHz

CANbus, EBI/EMI, SCI, SPI

DMA, POR, PWM, WDT

256

2MB (2M x 8)

FLASH

-

64K x 8

1.35 V ~ 1.65 V

A/D 40x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5777MK0MVA8R

NXP

NXP 32-BIT MCU QUAD POWER ARCH

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 300MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8.64MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 404K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 512-FBGA
Supplier Device Package: 512-TEPBGA (25x25)

封装: 512-FBGA

库存7,728

32-Bit Tri-Core

300MHz

CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART

DMA, LVD, POR, Zipwire

-

8.64MB (8M x 8)

FLASH

-

404K x 8

3 V ~ 5.5 V

A/D 12b SAR, 16b Sigma-Delta

Internal

-40°C ~ 125°C (TA)

-

512-FBGA

512-TEPBGA (25x25)

SPC5748GBK0AMMN6

NXP

TRIPLE CORE 6M FLASH

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 246
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-LBGA
Supplier Device Package: 324-MAPBGA (19x19)

封装: 324-LBGA

库存6,432

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

246

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

324-LBGA

324-MAPBGA (19x19)

SPC5777CDK3MMO4

NXP

POWER ARCH CORES 8MB FL

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存7,904

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CDK3MME4

NXP

POWER ARCH CORES 8MB FL

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存3,792

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

MPC5554MZP112

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z6
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 256
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存2,768

32-Bit

112MHz

CANbus, EBI/EMI, SCI, SPI

DMA, POR, PWM, WDT

256

2MB (2M x 8)

FLASH

-

64K x 8

1.35 V ~ 1.65 V

A/D 40x12b

External

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5777CDK3MMO4R

NXP

POWER ARCH CORES 8MB FL

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存6,384

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5675KF0MMM2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封装: 257-LFBGA

库存5,568

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 22x12b

Internal

-40°C ~ 125°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

SPC5675KFAVMS2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封装: 473-LFBGA

库存2,944

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 34x12b

Internal

-40°C ~ 105°C (TA)

-

473-LFBGA

473-MAPBGA (19x19)

SPC5675KFF0VMM2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封装: 257-LFBGA

库存2,528

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 22x12b

Internal

-40°C ~ 105°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

SPC5675KFAVMM2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

封装: 257-LFBGA

库存3,184

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 22x12b

Internal

-40°C ~ 105°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

SPC5675KF0MMS2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封装: 473-LFBGA

库存3,696

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 34x12b

Internal

-40°C ~ 125°C (TA)

-

473-LFBGA

473-MAPBGA (19x19)

SPC5748GHK0AMMN6

NXP

ULTRA RELIABLE MCU WITH VAST PER

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 246
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-LBGA
Supplier Device Package: 324-MAPBGA (19x19)

封装: 324-LBGA

库存6,128

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

246

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

324-LBGA

324-MAPBGA (19x19)

SPC5777MK0MVU8R

NXP

NXP 32-BIT MCU QUAD POWER ARCH

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 300MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8.64MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 404K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

封装: 416-BBGA

库存7,520

32-Bit Tri-Core

300MHz

CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART

DMA, LVD, POR, Zipwire

-

8.64MB (8M x 8)

FLASH

-

404K x 8

3 V ~ 5.5 V

A/D 12b SAR, 16b Sigma-Delta

Internal

-40°C ~ 125°C (TA)

-

416-BBGA

416-PBGA (27x27)

SPC5777CDK3MME4R

NXP

POWER ARCH CORES 8MB FL

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

封装: 416-BGA

库存2,592

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5675KF0VMS2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封装: 473-LFBGA

库存6,480

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 34x12b

Internal

-40°C ~ 105°C (TA)

-

473-LFBGA

473-MAPBGA (19x19)

SPC5777CSK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存5,664

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5675KFAVMS2R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

封装: 473-LFBGA

库存7,120

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

512K x 8

1.14 V ~ 5.5 V

A/D 34x12b

Internal

-40°C ~ 105°C (TA)

-

473-LFBGA

473-MAPBGA (19x19)

SPC5777CLK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存5,376

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CDK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存6,512

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SPC5777CCK3MMO3

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 516-BGA
Supplier Device Package: 516-MAPBGA (27x27)

封装: 516-BGA

库存4,624

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

516-BGA

516-MAPBGA (27x27)

SP5748GHK0AMMN6R

NXP

ULTRA RELIABLE MCU WITH VAST PER

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 246
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 324-LBGA
Supplier Device Package: 324-MAPBGA (19x19)

封装: 324-LBGA

库存7,200

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

246

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

324-LBGA

324-MAPBGA (19x19)