页 183 - 最新技术 | 黑森尔电子
联系我们
SalesDept@heisener.com +86-755-83210559 ext. 807
Language Translation

* Please refer to the English Version as our Official Version.

最新技术

记录 4,634
页  183/258
Technology Cover

2018-05-04, Samsung begins mass production of 10nm 16Gb automotive LPDDR4X DRAM

Samsung begins mass production of 10nm 16Gb automotive LPDDR4X DRAM

Technology Cover

2018-05-04, Würth Elektronik offers tiny step-down DC-DC converter

Würth Elektronik eiSos has expanded its range of power modules with a high power density step-down converter with variable output voltage.

Technology Cover

2018-05-04, Panasonic's Power Choke Coils and Hybrid Capacitors

LP series power chokes and ZE series capacitors (as shown) have high ripple currents (up to 2.0A) and low ESR values.

Technology Cover

2018-05-04, Toshiba launches 256GB USB 3.0 drive

Toshiba has announced a 256GB USB 3.0 flash drive with a maximum read speed of 150MB/s in a retractable form factor.

Technology Cover

2018-05-03, ON Semiconductor - Two controllers and switch device offer quick and easy adoption of USB-C

ON Semiconductor’s latest set of USB-C (Type-C) devices that are fully compliant with the latest revision 1.3 specifications, enabling simple integration into USB-C systems.

Technology Cover

2018-05-03, Texas Instruments - Analog input four-channel Class-D audio amplifier offers cost-optimisation in a tiny size

The Texas Instruments TPA6404-Q1 device is a four-channel analog-input Class-D audio amplifier that implements a 2.1MHz PWM switching frequency that enables a cost-optimised solution.

Technology Cover

2018-05-03, Microchip – Highly integrated small, single-sided PCB enables smaller, efficient designs

To remove the traditional design complexity in this space, Microchip Technology has released a new SOM featuring the SAMA5D2 MPU.

Technology Cover

2018-05-03, AVX - Space-level MLCCs meet extremely stringent DLA requirements for high-reliability performance

AVX Corporation claims to be the first, and currently only, company to offer space-level, X7R base metal electrode (BME) MLCCs with ‘M’ and ‘T’ reliability levels approved to the Defense Logistics Agency’s (DLA’s) MIL-PRF-32535 specification.

Technology Cover

2018-05-03, Texas Instruments – Mixed-signal MCU with an integrated 16-bit precision ADC delivers ultra-low-power performance

The SimpleLink MSP432P411x and MSP432P401x microcontrollers (MCUs), from Texas Instruments, are optimised wireless host MCUs with an integrated 16-bit precision ADC, delivering ultra-low-power performance including 100µA/MHz in active power and 820nA in standby power with FPU and DSP extensions.

Technology Cover

2018-05-03, Diodes Incorporated - Synchronous rectifier controller delivers higher efficiency and saves board space

Diodes Incorporated has introduced the ZXGD3113 synchronous rectifier controller. When joined with a MOSFET, the pairing can replace lossy Schottky rectifiers in power supplies based on a flyback or resonant converter topology.

Technology Cover

2018-05-03, ON Semiconductor - SiC diodes offer higher efficiency, power density and lower system costs

ON Semiconductor has extended its SiC diode portfolio by launching its newest family of 650V SiC Schottky diodes. The diodes’ cutting edge, silicon carbide technology offers higher switching abilities with lower power losses and effortless paralleling of devices.

Technology Cover

2018-05-03, Cypress - Accelerated secure IoT designs offer the highest level of protection defined by PSA

Cypress Semiconductor is offering the Platform Security Architecture (PSA) Trusted Firmware-M reference example from Arm for its PSoC 6 MCUs, allowing a solution that adheres to the highest level of protection as defined by PSA.

Technology Cover

2018-05-03, ROHM - Expanded series features ultra-low ohmic shunt resistors for automotive and industrial applications

With its PSR100 series, ROHM now has a significantly more compact version of its PSR series. These ultra-low ohmic shunt resistors have a high-power capability that are suited to current measurement in industrial and automotive applications.

Technology Cover

2018-05-03, KEMET - High voltage C0G ceramic capacitors meet wide bandgap semiconductors trend

KEMET has expanded its automotive grade, and commercial high voltage C0G Ceramic Capacitors as increasing use of wideband power semiconductors in power electronics applications pushes new inverter, and DC-DC converter designs forward with greater voltage, current, power density and frequency.

Technology Cover

2018-05-03, Texas Instruments - High-voltage LDO regulator is ideal for powering MCUs and CAN/LIN transceivers

In automotive battery-connected applications, low quiescent current (IQ) is important to save power and extend battery lifetime. It is especially necessary to have ultralow IQ for always-on systems.

Technology Cover

2018-05-03, Silicon Labs - MCUs extend battery life for IoT connected devices

Silicon Labs has expanded its popular EFM32 Tiny Gecko MCU family to meet the demands of developers creating the next generation of secure, battery-powered connected devices for the IoT.

Technology Cover

2018-05-03, AVX - MLCCs provide critical PCB space savings and component weight reductions

AVX Corporation has extended its space-qualified ESCC QPL 3009 Series X7R multilayer ceramic surface mount capacitors with new 200V PME MLCCs in 0805 – 2220 case sizes. Lightweight, compact, and available with capacitance values spanning 330pF – 330nF.

Technology Cover

2018-05-03, Analog Devices - Dual or single µModule regulator offers high peak efficient with excellent thermal performance

Analog Devices is offering the Power by Linear LTM4662, a dual 15A or single 30A step-down µModule regulator in a BGA package with an exposed stacked inductor for improved thermal dissipation properties.