Laird Connectivity has released the CFSA35606P, claimed to be the world's thinnest, ultra-low-profile DAS antenna with the broadest range of frequency coverage.
Analogue Devices HMC1099 offers a GaN power amplifier covering a 0.01-1.1GHz instantaneous bandwidth.
Silicon Labs launches the next-generation Z-Wave 700 on the Wireless Gecko platform, the industry’s most comprehensive hardware and software connectivity solution for the IoT. Z-Wave 700 delivers on the company's vision and platform integration roadmap following the company’s strategic acquisition of Z-Wave technology.
The TL7700 Voltage Supervisors from Texas Instruments are a bipolar integrated circuit designed for using as a reset controller in microprocessor and microcomputer systems.
AVX Corporation has added a new insulator to its 9176-800 Series low-profile IDCs - claimed to be the first and currently only industrial IDCs available in a 2.55mm profile - to provide an additional wire gauge and expand application suitability.
Texas Instruments TMUX611x Quad SPST Switches are modern CMOS devices that have four independently selectable SPST switches.
Taiyo Yuden has launched the new IEEE802.11ac compatible wireless communications modules, WYSAGVDXG and WYSEGVDXG at 24mm x 11.5mm x 2mm (with height as the maximum value).
Microchip has released the LAN7430/1 Ethernet bridge which provides new options for embedded and automotive platform designers who are exploring PCIe 3.1 LPSS L1.1 and L1.2 for power savings.
TLV9052 operational amplifier from Texas Instruments, highlights a high slew rate and low quiescent current, the dual op-amp is perfect for battery-powered motor-drive applications, as well as large appliances, sensor signal conditioners, photodiode amplifiers, and low-side current sensing.
Littelfuse has introduced two second-generation series of 650V, AEC-Q101-qualified SiC Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are offered with a selection of current ratings (6A, 8A, 10A, 16A or 20A).
Hirose has expanded its rugged ix industrial connector family to include a vertical receptacle. The ix80 Series vertical receptacle gives design flexibility for manufacturers of next-generation industrial equipment.
Amphenol RF has released the SMA Quick-Connect adapter, a straight jack to straight plug configuration, as part of a wide portfolio of coaxial adapters.
Renesas Electronics Corporation has expanded its RX24T and RX24U Groups of 32-bit MCUs to incorporate new high-temperature-tolerant models for motor-control applications that need an extended operating temperature range.
Microchip has released what is claimed to be the industry’s smallest IEEE 802.15.4-compliant module that couples an ultra-low-power MCU with a sub-GHz radio, expediting time to market and offering long-lasting battery life in wireless-networked sensors.
OSRAM provides interoperability between the Casambi CBU-DCS module and OSRAM DEXAL driver. Accordingly, the module is registered as an official ‘Works with OSRAM DEXAL’ component.
RECOM has introduced medical-grade DC-DC modules which provide 3.5W, 5W and 6W. These converters offer all key features demanded for critical medical applications while keeping down the cost of these modular solutions.
TE Connectivity has released its HDSCS connector series, a growing product line that provides solutions for applications where sealed, rugged connections are required.
Toshiba Electronics Europe has launched a range of single-supply single-gate logic devices. In total the lineup includes 31 devices that ease the design of voltage-level translation as applied in data communication between devices, such as between microprocessors and peripherals.
