页 175 - 最新技术 | 黑森尔电子
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最新技术

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Technology Cover

2019-04-06, Microchip - Develop low-power wireless sensor nodes with small sub-GHz module

Microchip has released what is claimed to be the industry’s smallest IEEE 802.15.4-compliant module that couples an ultra-low-power MCU with a sub-GHz radio, expediting time to market and offering long-lasting battery life in wireless-networked sensors.

Technology Cover

2019-04-06, Osram - Partnership boosts wireless lighting within smart buildings

OSRAM provides interoperability between the Casambi CBU-DCS module and OSRAM DEXAL driver. Accordingly, the module is registered as an official ‘Works with OSRAM DEXAL’ component.

Technology Cover

2019-04-06, RECOM - Low power DC-DC converters for critical medical designs

RECOM has introduced medical-grade DC-DC modules which provide 3.5W, 5W and 6W. These converters offer all key features demanded for critical medical applications while keeping down the cost of these modular solutions.

Technology Cover

2019-04-06, TE Connectivity - Rugged connector series provides high levels of design flexibility

TE Connectivity has released its HDSCS connector series, a growing product line that provides solutions for applications where sealed, rugged connections are required.

Technology Cover

2019-04-06, Toshiba - New single-supply single-gate logic devices supports low voltage operation

Toshiba Electronics Europe has launched a range of single-supply single-gate logic devices. In total the lineup includes 31 devices that ease the design of voltage-level translation as applied in data communication between devices, such as between microprocessors and peripherals.

Technology Cover

2019-04-06, Texas Instruments - BAW technology shrinks BOM and improves network performance

Texas Instruments offers new BAW-based embedded processing and analog chips for the next generation of connectivity and communications infrastructure.

Technology Cover

2019-04-06, Bourns - New family of P-TCO devices to protect USB-C cables

Bourns has introduced a new family of Polymeric Thermal Cutoff (P-TCO) devices created to protect USB-C cables from destructive and potentially dangerous thermal runaway events.

Technology Cover

2019-04-04, Texas Instruments - Smart high-side switches for 12V automotive system usage

Texas Instruments TPS1HA08-Q1 Smart High-side Switches provide robust protection and diagnostic features designed for use with 12V automotive systems.

Technology Cover

2019-04-04, Diodes Incorporated - Bipolar transistors enable higher power density

The Diodes Incorporated family of NPN and PNP power bipolar transistors supplied in a small form factor (3.3mm x 3.3mm), provide increased power density for applications demanding up to 100V and 3A.

Technology Cover

2019-04-04, ON Semiconductor - Out-of-the-box sensor development kit for power-optimised IoT applications

ON Semiconductor has introduced the RSL10 Sensor Development Kit, designed to give engineering teams a comprehensive platform for creating IoT applications with cutting-edge smart sensor technology, and enabled by what is claimed to be the industry’s lowest power Bluetooth Low Energy radio.

Technology Cover

2019-04-04, Analog Devices - Audio bus and processor technologies improve energy efficiency and infotainment experience

Analog Devices has announced that BYD Co., Ltd has chosen the company’s A2B and SHARC DSP to build more energy efficient and eco-friendly vehicle platforms while improving the immersive audio entertainment encounter for drivers.

Technology Cover

2019-04-04, TDK - Low loss DIN rail redundancy module has load sharing balance indication

TDK Corporation has introduced the DRM40 series of DIN rail mount redundancy modules. Two 10V to 30VDC inputs are each rated at 20A and the output at 40A. A 150% peak load ability for four seconds is offered for capacitive and inductive loading.

Technology Cover

2019-02-22, Murata - Narrow-band IoT module stretches battery life in a small size

Murata has released what it believes to be the world’s smallest narrow-band IoT cellular wireless module. The device measures just 15.6mm x 14mm x 2.2mm and is manufactured on a PCB with a metal casing, and is intended for use in compact, battery-powered IoT/IIoT applications.

Technology Cover

2019-02-22, Vishay Intertechnology - Add heart rate monitoring capability to any type of consumer electronics device

Vishay Intertechnology can help manufacturers add a heart rate monitoring capability to any type of consumer electronic device.

Technology Cover

2019-02-22, Microchip - Technology simplifies automotive infotainment networking

Microchip has announced what is claimed to be the industry’s most efficient automotive infotainment networking solution. The solution supports all data types, including video, audio, control and Ethernet, over a single cable.

Technology Cover

2019-02-22, Renesas Electronics - System-level EV and power management expertise boosts performance for racing team

Renesas Electronics has announced it is expanding its strategic technology partnership with Mahindra & Mahindra, Ltd and Mahindra Racing competing in the ABB FIA Formula E Championship, for the 2018-19 season.

Technology Cover

2019-02-22, ROHM – New SiC power module achieves high level of reliability in extreme environments

ROHM has developed a 1700V/250A rated SiC power module that gives what is claimed to be the industry’s highest level of reliability optimised for inverter and converter applications including outdoor power generation systems and industrial high power supplies.

Technology Cover

2019-02-22, Texas Instruments - Current-shunt monitors accurate current measurements in the microamp range (INA190)

Texas Instruments INA190 Current-Shunt Monitors give overcurrent protection, precision current measurement for system optimisation, or in closed-loop feedback circuits.