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最新技术

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2023-05-23, Building a Sustainable Tomorrow with Component Technology

While it is true that manufacturers of components such as semiconductors are not environmentally friendly, electronic components in general play a key role in reducing humans' impact on the environment. From monitoring and managing environmental conditions to generating sustainable electricity and even monitoring nuclear fusion systems, advances in component circuits are propelling us towards a more sustainable future.

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2023-05-20, How is human microwave magnetic induction technology applied in smart hotel?

At present, microwave detection is widely used to detect the presence of the body in the magnetic induction region. Moreover, radar has large magnetic induction Angle of view, fast reaction speed, material characteristics of non-metallic materials, strong environmental adaptability, and is not affected by natural environment, ambient temperature, dust and other factors.

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2023-05-19, TDK offers complete ESD protection for USB-C with ultra-compact TVS diodes

TDK has introduced an ultra-compact TVS diode for ESD protection applications with USB-C ports and other high-speed ports. TVS diodes with ultra-low parasitic capacitance and low clamp voltage are especially needed for ESD protection applications with high-speed interfaces (Tx/Rx) such as USB-C that comply with the USB4 (Version 1) specification and transfer speeds up to 40 Gbit/s.

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2023-05-19, New long distance USB 3.2 clock restorer/Signal repeater device

Microchip Technology announced the launch of two new clock restorer/signal repeater devices. The automotive EQCO510 and industrial EQCO5X31 clock restator/signal repeater devices extend USB coverage up to 15 meters for maximum coverage and are compatible with USB 3.2 first generation ultra high speed protocol.

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2023-05-18, Holtek introduces lithium-ion battery protection MCU

Holtek has launched a new lithium battery protection MCU HT32F61630/HT32F61641, in addition to the original HT45F8650/HT45F8662 8-bit MCU series, the new higher-order 32-bit Arm® Cortex®-M0+ lithium battery protection MCU products

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2023-05-18, TDK introduces ultra-thin magnetic sheets with high permeability for NFC applications

TDK Corporation has further expanded its Flexield shielding material lineup with the introduction of the IFQ06 series, a material with high permeability (μ ') and low magnetic loss (μ ") designed for near-field communication (NFC) applications. The IFQ06 material also provides efficient protection against performance-reducing design features that complicate the NFC design, such as metal objects located directly behind the antenna.

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2023-05-18, YAGEO introduces capacitors for high power and high efficiency LLC circuits

LLC resonant converters have become a hot topic in power electronics because they can meet the high performance requirements of modern power supply design. This switch-over DC/DC power converter enables higher switching frequencies and reduced switching losses, making it more suitable for high power and high efficiency applications. It is widely used in the field of power supply, including: high-end consumer electronics, industrial power management and electric vehicle related charging system.

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2023-05-18, Onsemi has signed a strategic SiC supply agreement with charging supplier Kempower

Onsemi, a smart power and sensing technology provider, announced that it will supply Kempower with onsemi EliteSiC SIC MosFEts and diodes for scalable electric vehicle (EV) chargers under a new strategic agreement. The ongoing collaboration between the two companies enables Kempower's suite of EV charging solutions to employ a variety of power semiconductor technologies, including onsemi's EliteSiC.

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2023-05-18, Intelligent lighting control technology

Today, the advantages of intelligent control of lighting have led to new ideas. If the intelligent control of lighting is ignored, the cause of green lighting will be stagnant, lighting modernization will be out of the question, lighting intelligent control technology has become the cornerstone of green lighting. Electrification, automation and intelligence are the steps of intelligent lighting control. In the future, the intelligent control of lighting will advance towards the direction of wisdom along with the journey of human high and new technology.

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2023-05-18, Analog Devices is investing 630 million euros in a next-generation semiconductor R&D and manufacturing facility

Analog Devices, the world's leading semiconductor company, has announced a €630 million investment in a new 45,000 sq ft advanced R&D and manufacturing facility at its European regional headquarters in Raheen Business Park, Limerick, Ireland.

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2023-05-18, Infineon acquires Imagimob, a leader in micro-machine learning

Infineon Technologies has announced that it has acquired Stockholm-based start-up Imagimob LTD., a leading platform provider that enables the development of machine learning (ML) solutions on edge devices. With this acquisition, Infineon further strengthens its position as a provider of world-class machine learning solutions and significantly expands its AI product lineup.

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2023-05-18, Texas Instruments ultra low power mcu provides high performance analog peripheral integration

The Texas Instruments MSPM0L134x and MSPM0L130x MCUs are part of MSP’s highly integrated, ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform functioning at up to 32MHz frequency. These cost-optimised MCUs provide high-performance analog peripheral integration, support extended temperature ranges from -40C to 125C, and operate with supply voltages ranging from 1.62V to 3.6V.

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2023-05-17, Achieve the highest power density voltage stabilized DC/DC converter

A new reference design from EPC and ADI uses a new, fully optimized Analog controller to drive EPC's gallium nitride FET, achieving an efficiency of more than 96.5%.

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2023-05-17, Bel Power Solutions introduces TEC2200/2401/2600 AC-DC front-end power supply

Bel Power Solutions TEC2200/2401/2600 AC-DC front-end power supply is a hot-swappable public redundant power supply (CRPS) that supports N+1 redundancy architecture. These power supplies convert standard AC mains/high voltage direct current (HVDC) busbar voltage to 12VDC main power output to power systems using a distributed power architecture.

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2023-05-17, Rotary and linear magnetic position sensors for automotive and industrial applications

A definite trend in the automotive industry is autonomous driving. Although there is still some way to go before the practical application of fully autonomous driving, related research and development and application are in full swing, which is fully reflected in the increasingly rich and perfect advanced driver assistance systems (ADAS). The A31315 is a rotating and linear magnetic position sensor from Allegro's 3DMAG™ family for automotive and industrial applications that combines Allegro's long-proven planar and vertical Hall effect technology

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2023-05-17, A new generation of dual-channel isolated grid driver IC that improves the performance of SMPS designed systems

To meet the latest technologies such as gallium nitride (GaN) power switches for high-voltage DC-DC power conversion, Infineon Technologies has introduced a new family of dual-channel electrically isolated EiceDRIVER™ gate driver IC products.

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2023-05-17, Toshiba launches Overtemperature Detection IC ThermoflaggerTM series IC

Toshiba Electronics Components and Memory Devices Inc. announced the launch of the first two products in the overtemperature Detection IC ThermoflaggerTM series: "TCTH021BE" FLAG signal with no latch function when an abnormal state is detected, and "TCTH022BE" FLAG signal detection with latch function. They use positive temperature coefficient (PTC) thermistors to detect temperature rise inside electronic devices in simple circuit configurations.

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2023-05-17, The smaller, thinner and lighter FO-USON8 is packaged with 128Mb SPI NOR Flash

Industry leading semiconductor device supplier GigaDevice has announced the launch of SPI NOR Flash GD25LE128EXH in a 3mm×3mm×0.4mm FO-USON8 package with a maximum thickness of only 0.4mm and a capacity of up to 128Mb. It is the smallest plastic packaging product that can be realized in this capacity in the industry at present.