To meet the growing demand for energy efficiency and sustainability in buildings, weather, environmental and industrial measurement equipment manufacturer Vaisala has expanded its heating, ventilation and air conditioning (HVAC) portfolio with the introduction of the new Vaisala GMD110 CO2 transmitter.
The DS4 Intelligent Oxygen sensor from EC Sense is an industrial-grade intelligent gas sensor using reliable printed solid polymer electrochemical sensor technology. Small volume and compact structure design, using high-performance microprocessor, equipped with high precision ADC, as well as intelligent algorithm design, can be easily integrated into the Internet of Things and other monitoring systems, widely used in industrial, commercial, civil and medical fields.
Abracon's supercapacitors use the industry's latest two-layer technology to achieve high energy and high power density. With different combinations of these two characteristics, these ultracapacitors can be used in applications requiring fast charge/discharge or long lasting power output. Abracon supercapacitors can operate in the temperature range as low as -40C where conventional batteries cannot be used.
Infineon Technologies has announced that QDPAK and DDPAK Top Cooled (TSC) packages for its high-voltage MOSFET devices have been successfully registered as JEDEC standard. This move not only further strengthens Infineon's goal to extend the standard package design and shape of the TSC package to a wide range of new designs, but also gives Oems more flexibility and advantage to create differentiated products in the market and raise power density to even higher levels to support a variety of applications.
Infineon Technologies has released a new power module for the car :HybridPACK Drive G2. It builds on its established HybridPACK Drive G1 concept in the integrated B6 package, offering scalability in the same footprint and extending it to higher power and ease of use.
Wurth Elektronik now offers an extensive A-coded M12 circular connector product portfolio (DIN EN 61076-2-101). High quality male and female connectors, screw fit for panel mounting and cable connections, ideal for use in harsh environments of dust, moisture and vibration
Transphorm has announced the launch of six surface mount devices (SMDS) in industry-standard PQFN 5x6 and 8x8 packages. These SMDS offer the reliability and performance benefits of Transphorm's patented SuperGaN® d-mode dual-switched normally closed platform and are packaged in a configuration commonly used by competing e-mode GaN devices. As a result, these six devices can easily be used as a first design source in an e-mode GaN solution, or as a pin-to-pin-compatible plug-and-pull replacement and/or second source.
Infineon Technologies Inc. introduced EZ-PD™ CCG7D, a dual-port USB-C PD (charging) solution that integrates a boost controller for on-board charging applications, meets the latest USB Type-C and PD3.1 specifications and is AEC Q-100 certified. This USB-C PD solution can be used specifically for automotive applications that support Display port, or USB-C Alternate mode.
Infineon has launched SEMPER™ Nano NOR Flash memory. The memory is specially optimized for use in small, battery-powered electronic devices. New wearable and industrial applications such as fitness trackers, smart headsets, health monitors, drones and GPS navigation are emerging, helping to achieve more functions such as accurate tracking, recording critical information, enhancing security and reducing noise
Bel Fuse Inc has expanded its portfolio to include the TET3600-48-104RA. This 3.6kW titanium efficient AC/DC front-end power supply converts up to 277VAC into a main adjustable (42-58VDC) output for powering high-performance datacentre, network, industrial and broadcast applications.
TDK has expanded its Micronas embedded motor controller product portfolio and launched the first members of the new HVC 5x series programmable SoC motor controllers for driving small stepper, BDC, and BLDC motors in automotive and industrial applications. The new series provides a specific application evolution of popular HVC 4x devices, which plan to provide "one IC fits all" motor control solutions for stepper, BLDC, and BDC motors.
ROHM has developed the 4ch/6ch LED driver ICs, BD83A04EFV-M, BD83A14EFV-M, and BD82A26MUF-M, created for medium to large-size displays in-car infotainment and instrument clusters.
XMEMS Labs has announced the full availability of three of its revolutionary MEMS miniature speaker solutions for immediate integration into next-generation true wireless stereo (TWS) headphones, in-ear headphones (IEM), digital hearing AIDS, and emerging personal audio electronics such as smart glasses and sleep earplugs.
General Assembly Holdings, a leading international distributor of semiconductor components in the Asia Pacific region, announced the launch of its Shiping vehicle Body Control Module (BCM) solution based on NXP S32K344 chips.
Littelfuse announced the introduction of Series 3425L SMD self-restoring PPTC (polymer positive temperature coefficient) overcurrent circuit protection devices. The latest 3425L series SMD PPTC is an extension of the Littelfuse PolySwitch® series self-restoring high-voltage overcurrent protection to provide self-restoring high-voltage overcurrent protection in compact surface-mount 8763mm (3425 mils) size.
Infineon Technologies is diversifying its silicon carbide (SiC) supplier system and has entered into a long-term agreement with Chinese sic supplier Beijing Tianke Heda Semiconductor Co., LTD. (" Tianke Heda ") to secure additional and competitive supply of SIC materials.
Solidigm, a leading global provider of innovative NAND flash memory solutions, announced the launch of Solidigm Synergy2.0 software. Solidigm Synergy software suite improves overall system performance, and the combination of software and hardware provides a superior user experience compared to traditional SSD hardware.
MikroElektronika is an embedded solutions company that dramatically reduces development time by providing innovative hardware and software products based on mature standards. Silicon Labs, a leader in secure, smart wireless technology for a more connected world, has become the first IC vendor to support mikroSDK 2.0 Click Board
